At an Architecture Day event hosted this week, Intel articulated an unusually lucid strategy for its development of future processors, most of which will revolve around fragmenting the various elements of a modern CPU into individual, stackable “chiplets.” Intel’s big goal for late 2019 is to offer products built on what it calls Foveros 3D stacking: an industry-first implementation of stacked processing components inside a chip. We’ve already seen stacked memory; now, Intel is doing something similar with the CPU, allowing its designers to essentially drop in extra processing muscle atop an already assembled chip die. So your on-die memory, power regulation, graphics, and AI processing can all constitute separate chiplets, some of which...
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